AMD CrossFire™ Series Chipset
Packaging and Branding Guidelines
Summary of All Products Belonging to
the AMD CrossFire™ Series Chipset
The list below summarizes the CrossFire™ Chipset product offering
for the AMD platform
BRAND NAMES
ASIC Variant
RD480
Platform
DT
Chipset
AMD 480X
AMD 550X
AMD 580X
RD550
DT
RD580
DT
A M D 5 8 0 X
Master
Brand
Logic
Multi
GPU
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AMD CrossFire Chipset
Section 1
Logos and Text Treatment
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AMD CrossFire Chipset
Logos and Text Treatment
Logos and text treatments lend brand value to your marketing and packaging.
By including these graphic elements in your packaging, you create immediate
awareness and connection with your audience.
This guide outlines the proper usage of all AMD Chipset logos.
All logos must be used as is and cannot be altered in any way.
If there are any questions regarding these logo or brand identity guidelines,
please contact your regional partner marketing manager.
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AMD CrossFire Chipset
Logos and Text Treatment
AMD should be in full caps. All AMD Chipset and product feature names should
be spelled out in lower case with the first letter capitalized. Do not spell the
entire product or product feature name in capital letters only. For ‘CrossFire’,
‘C’ and ‘F’ are in capital letters and should be followed by “TM”.
Correct Examples
Incorrect Examples
AMD 580X CrossFire™ Chipset
AMD 580X CrossFire™ Chipset
AMD 580X CrossFire™ Chipset
AMD 480X CROSSFIRE™ Chipset
Amd 480X Crossfire™ Chipset
AMD 480X CrossFire Chipset
Note: ASIC variant name (i.e R580) is NOT to be used at anytime.
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AMD CrossFire Chipset
Logos and Text Treatment
Use of trademark “™” and “®”
COPY
In all copy, the applicable trademark notice must be used beside all product
and product feature names used in: (i) all headlines; and (ii) the first use of
the product or product feature name in the text.
PACKAGING
The applicable trademark notice must be used beside all product names
prominently featured (greater than 2X text size) on the packaging. For all
packaging copy, the applicable trademark notice must be used beside the first
instance of use of all product and product feature names used in the text.
NOTICE SYMBOL
Registered marks should be followed by the “®” notice symbol. All other
product and product feature names for which AMD is claiming trademark rights
or for which AMD has filed a trademark application should be followed by the
“™” notice symbol. Please check with the Chipset Marketing Department to
ensure you are using the correct notice symbol.
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AMD CrossFire Chipset
Logos and Text Treatment
Using AMD CrossFire Chipset Logos
Use AMD CrossFire Chipset logos when promoting motherboards or systems
with these chipset.
The logos must be used in the following applications:
• On the heat sink for Northbridge. (Logo on the Southbridge is optional)
• On the PC boot up screen (BIOS Splash)
• On retail packaging
• Advertising and promotional material (print and online)
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AMD CrossFire Chipset
Logos and Text Treatment
This logo is used on the Northbridge and or Southbridge on the Motherboard
heat sink
File name: _HS.eps
These logos are used on the PC boot up Screen (BIOS Splash), for
motherboard packaging (see packaging guidelines for more details),
advertisement, collateral material etc.
Logo Use
File name:
Splash Screen _BIOS.bmp
Print/Package _PRINT.eps
Web/Electronic _GP
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AMD CrossFire Chipset
Logos and Text Treatment
Requirements for BIOS Splash Screen Logo
The BIOS Splash screen logo must be placed either in the center of the
monitor or the upper top left-hand corner of the screen
The logo must be no smaller than 2 inches in width (length to be proportional)
The logo must be present for a minimum of 2 seconds
2 inches
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AMD CrossFire Chipset
Section 2
Packaging Guidelines
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AMD CrossFire Chipset
Packaging Guidelines
These packaging standards have been developed to provide consistent brand
recognition for the logo established for all AMD products, and to more clearly
communicate the consumer benefits of AMD products.
Please follow these guidelines for all motherboard packaging with the AMD
CrossFire chipset product line.
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AMD CrossFire Chipset
Packaging Guidelines
Mandatory Box Layout Requirements:
There is only one mandatory element for all partner packaging:
The AMD CrossFire Chipset product logo MUST be on the front and back panels
of the retail box.
This elements must be reproduced without variation in the positions identified.
Partner artwork can then be placed in the grey zones of the marked illustration
below.
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AMD CrossFire Chipset
Packaging Guidelines
Other Mandatory Requirements:
1. The proportion of logo size to package area shown must be maintained
(see below)
2. To ensure sufficient visibility, an unobstructed area should surround the
Chipset badge logo.
3. The ™ should be placed after CrossFire. The ™ must always appear at
least once.
4. Pantone color 347 is always used for AMD green. Pantone color 185 is
always used for CrossFire red.
5. Partners must include the following standard legal line on all packaging or
other advertising materials which utilize any AMD logos or visual identities:
“AMD, the AMD Arrow logo, ATI, CrossFire, Radeon, and combinations
thereof are trademarks of Advanced Micro Devices, Inc. Other names are
for informational purposes only and may be trademarks of their respective
owners.”
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AMD CrossFire Chipset
Packaging Guidelines
Logo Sizing Requirements
1. Logo must be 0.375” away from box edge and other logos.
2. The logo must be at least 2” wide.
2”
0.375”
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AMD CrossFire Chipset
Packaging Guidelines
Incorrect Use of Chipset Package Art Template
1. The chipset badge logo is not placed on the front/top side of the packaging
2. The badge is two small, not meeting the 2” wide criteria
3. Partners may not add unauthorized numeric or alphabetical extensions
after the Chipset technology brand name. e.g. AMD 580X Pro Lite etc.
4. The Chipset badge cannot be place in alternative locations on a partner
pack
2”
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AMD CrossFire Chipset
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